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陳蘭洲、博士生張超的論文在COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS 刊出
發布時間:2019-10-11 10:49:12     發布者:易真     浏覽次數:

标題: Enahanced biosorption of Cu(II) by magnetic chitosan microspheres immobilized Aspergillus sydowii (MCMAs) from aqueous solution

作者: Zhang, C (Zhang, Chao); Liu, SY (Liu, Siyao); Li, SX (Li, Shuangxi); Tao, Y (Tao, Yue); Wang, PP (Wang, Panpan); Ma, XY (Ma, Xinyue); Chen, LZ (Chen, Lanzhou)

來源出版物: COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS  : 581  文獻号: 123813  DOI: 10.1016/j.colsurfa.2019.123813  出版年: NOV 20 2019  

摘要: The magnetic chitosan microspheres immobilized Aspergillus sydowii (MCMAs) was prepared and characterized by SEM, BET, XRD and VSM analyses, and used to adsorb Cu(II) from aqueous solution under different influence factors such as contact time, initial Cu(II) concentration and biosorbent dose. Characterization results showed that MCMAs had large specific surface area and were rapidly separated from aqueous solution by using an adscititious magnetic field. Batch adsorption experiments showed that Cu(II) adsorption capacity of MCMAs was up to 119.21 mg g(-1) (under the optimal condition. The CO, OH and NH---) groups played an important role in Cu(II) chelation observed from FTIR spectra. Cu(II) adsorption onto MCMAs was well described by pseudo-second-order kinetics and Langmuir isotherm, and the adsorption process involved surface and intra-particle diffusion. In addition, MCMAs showed good recyclable efficiency after four adsorption-desorption cycles.

入藏号: WOS:000487764400030

語言: English

文獻類型: Article

作者關鍵詞: Magnetic chitosan microsphere; Aspergillus sydowii; Immobilization; Cu(II); Adsorption

地址: [Zhang, Chao; Liu, Siyao; Li, Shuangxi; Tao, Yue; Wang, Panpan; Ma, Xinyue; Chen, Lanzhou] Wuhan Univ, Hubei Res Ctr Environm Remediat Technol, Hubei Key Lab Biomass Resources Chem & Environm B, Coll Resource & Environm Sci, Wuhan 430079, Hubei, Peoples R China.

通訊作者地址: Chen, LZ (通訊作者)Wuhan Univ, Coll Resource & Environm Sci, Wuhan 430079, Hubei, Peoples R China.

電子郵件地址: chenlz@whu.edu.cn

影響因子:3.131


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